DIGIMAT



Search

DIGIMAT

The DIGIMAT software platform developed by e-Xstream engineering is a nonlinear multi-scale material & structure modelling platform for predicting the behaviour of mixed materials and micro structure materials such as;

  • Engineering plastics with fibre reinforcements
    • short/long fibres
    • glass
    • carbon
  • Engineering plastics with filler
    • glass
    • beads
    • talc
  • Hard metals (cemented carbides)
  • Nano composites
  • Rubber

The DIGIMAT modelling platform is made up of a number of applications



Digimat-MF is the Mean-Field homogenization module of DIGIMAT which offers the capability to define the local material behaviour as a function of the material behaviour of:

  • the matrix and inclusion phases
  • the microstructure morphology (inclusions weight, shape and size)

It is a user-friendly micromechanical material modelling software where the user inputs the material behaviour of the phases, the microstructure description and the loading applied to the resulting multi-phase material, guided by a tree data structure.
more information



DIGIMAT has coupled interfaces to major injection molding and structural FEA software to enable seamless multi-scale analyses of multi-phase materials and structures.

The interface between DIGIMAT and LS-DYNA offers LS-DYNA users the capability to perform accurate explicit FEA of multi-phase materials where Digimat-MF is used to model the nonlinear, anisotropic and rate-dependent behaviour of these materials.
more information



Digimat-FE is the homogenization software based on the nonlinear Finite Element modelling of realistic Representative Volume Element (RVE) of complex material microstructure.
more information



Map is a 3D mapping software used to transfer fibre orientation, residual stresses and temperature from the injection molding mesh to the optimal structural FEA mesh.
more information



Micross offers sandwich panel producers and end users the capability to perform the most common test procedures for the modelling of honeycomb core sandwich structures.
more information

 

 

Image courtesy of Nokia